US 11,054,403 B2
Cleaning composition and method for enhanced sealant adhesion
Binil Itty Ipe Kandapallil, Summerville, SC (US); Carissa Ann Pajel, Mercer Island, WA (US); Dion Paul Coleman, Issaquah, WA (US); Darrin Michael Hansen, Seattle, WA (US); and Judith A. Werner, Maple VAlley, WA (US)
Assigned to The Boeing Company, Chicago, IL (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Jul. 10, 2019, as Appl. No. 16/508,015.
Application 16/508,015 is a division of application No. 15/459,970, filed on Mar. 15, 2017, granted, now 10,401,339.
Prior Publication US 2019/0331649 A1, Oct. 31, 2019
Int. Cl. C11D 3/40 (2006.01); G01N 31/22 (2006.01); B05D 3/10 (2006.01); C11D 3/16 (2006.01); C11D 3/20 (2006.01); C11D 3/43 (2006.01); C11D 11/00 (2006.01); B64F 5/30 (2017.01); B64F 5/40 (2017.01)
CPC G01N 31/22 (2013.01) [B05D 3/102 (2013.01); C11D 3/162 (2013.01); C11D 3/20 (2013.01); C11D 3/40 (2013.01); C11D 3/43 (2013.01); C11D 11/0023 (2013.01); B64F 5/30 (2017.01); B64F 5/40 (2017.01)] 20 Claims
OG exemplary drawing
 
1. A dyed solvent composition for cleaning a metal substrate and for bonding of a sealant to be applied thereover; the composition comprising:
one or more environmentally acceptable volatile organic solvents;
at least one dye having an absorption maximum between 390 nanometers and 700 nanometers; and
at least one adhesion promoter having: a bonding affinity for a metal substrate surface cleanable by the one or more environmentally acceptable volatile organic solvents; and a bonding affinity for a sealant applicable to the metal substrate surface, the at least one adhesion promoter being present in an amount between about 0.01 to about 2.0 volume percent of the dyed composition.