US 11,054,383 B2
Chip-scale sensing device for low density material
Jerome Chandra Bhat, Palo Alto, CA (US); Jim Chih-Min Cheng, Fremont, CA (US); and Richard Ian Olsen, Truckee, CA (US)
Assigned to InSyte Systems, Inc., Newark, CA (US)
Filed by InSyte Systems, Inc., Newark, CA (US)
Filed on Jan. 22, 2019, as Appl. No. 16/254,241.
Claims priority of provisional application 62/620,963, filed on Jan. 23, 2018.
Claims priority of provisional application 62/620,372, filed on Jan. 22, 2018.
Prior Publication US 2019/0227024 A1, Jul. 25, 2019
Int. Cl. G01N 27/407 (2006.01); G01N 27/404 (2006.01); G01N 27/30 (2006.01); G01N 27/416 (2006.01)
CPC G01N 27/4078 (2013.01) [G01N 27/304 (2013.01); G01N 27/404 (2013.01); G01N 27/407 (2013.01); G01N 27/4166 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A chip-level electrochemical sensing device, comprising:
a base wafer having an externally facing side and an internally facing side, said internally facing side partially defining a sensor chamber, said sensor chamber being at least partially defined by a cap wafer disposed over the internally facing side of said base wafer, said base wafer further having a plurality of through vias penetrating said base wafer and extending between the internally and externally facing sides thereof;
a first one of said through vias comprising a gas port that allows gas communication between said externally and internally facing sides of the base wafer, and specifically allowing a gas on the externally facing side of the base wafer to pass through said gas port through via into said sensor chamber;
an electrochemical sensor responsive to a property of said gas, disposed in said sensor chamber;
the electrochemical sensor comprising a first electrode and a second electrode, wherein the first and second electrodes are coupled by an electrolyte, and wherein the first electrode is exposed to said gas entering the sensor chamber through said gas port;
a second one of said through vias comprising a conducting through via electrically coupling said first electrode of the electrochemical sensor to a first electrical contact on the externally facing side of said base wafer;
a third one of said vias comprising a conducting through via electrically coupling said second electrode of the electrochemical sensor to a second electrical contact on the externally facing side of said base wafer;
at least one set of electrical connections that carry electrical signals to and from said device; and
an integrated circuit constructed on or in any of the base wafer and cap wafer, said integrated circuit electrically coupled to said set of electrical connections,
wherein any of said base wafer and said cap wafer comprise a printed circuit board (PCB).