US 11,054,319 B2
Strain gauge with mechanically decoupled temperature sensor
Daniele Caltabiano, Agrate Brianza (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Sep. 11, 2020, as Appl. No. 17/18,276.
Application 17/018,276 is a continuation of application No. 15/899,204, filed on Feb. 19, 2018, granted, now 10,782,196.
Prior Publication US 2020/0408621 A1, Dec. 31, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 1/22 (2006.01); G01B 7/16 (2006.01); G01D 5/16 (2006.01); G01L 1/04 (2006.01); G01L 1/06 (2006.01); G01L 1/18 (2006.01); G01L 19/00 (2006.01); G01L 9/04 (2006.01); G01L 9/00 (2006.01)
CPC G01L 1/2281 (2013.01) [G01B 7/22 (2013.01); G01D 5/16 (2013.01); G01L 1/04 (2013.01); G01L 1/06 (2013.01); G01L 1/18 (2013.01); G01L 1/2293 (2013.01); G01L 9/0042 (2013.01); G01L 9/0054 (2013.01); G01L 9/045 (2013.01); G01L 19/0092 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor device, the method comprising:
forming a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and
forming a temperature sensor in an opening of the substrate, the temperature sensor being attached to the substrate by a spring.