US 11,053,602 B2
Micro-roughened electrodeposited copper foil and copper foil substrate
Yun-Hsing Sung, Taoyuan (TW); and Chun-Yu Kao, Yunlin County (TW)
Assigned to CO-TECH DEVELOPMENT CORP., Taipei (TW)
Filed by CO-TECH DEVELOPMENT CORP., Taipei (TW)
Filed on Sep. 9, 2019, as Appl. No. 16/563,954.
Claims priority of application No. 107132627 (TW), filed on Sep. 17, 2018.
Prior Publication US 2020/0087811 A1, Mar. 19, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. B21C 37/00 (2006.01); C25D 7/06 (2006.01); C25D 3/38 (2006.01); C25D 5/16 (2006.01); C25D 1/04 (2006.01)
CPC C25D 7/0614 (2013.01) [C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 5/16 (2013.01); Y10T 428/12431 (2015.01)] 12 Claims
OG exemplary drawing
 
1. A micro-roughened electrodeposited copper foil comprising a micro-rough surface that has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters, wherein each of the V-shaped grooves having an average depth less than 1 μm is defined by adjacent two of the peaks, and the micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 μm;
wherein the micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06, and the Rlr value satisfies the equation of Rlr=Rlo/L, where Rlo represents a measured profile length and L represents a measured distance.