US 11,053,422 B2
Chain-reactive heat-generating microcapsules
Eric J. Campbell, Rochester, MN (US); Sarah K. Czaplewski, Rochester, MN (US); Joseph Kuczynski, North Port, FL (US); and Timothy J. Tofil, Rochester, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Mar. 15, 2017, as Appl. No. 15/459,573.
Prior Publication US 2018/0265428 A1, Sep. 20, 2018
This patent is subject to a terminal disclaimer.
Int. Cl. C09K 5/18 (2006.01); B23B 5/16 (2006.01); C09K 8/588 (2006.01)
CPC C09K 5/18 (2013.01) [B23B 5/16 (2013.01); C09K 8/588 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A microcapsule, comprising:
a first compartment including a first component;
a second compartment including a second component; and
a heat activated isolating structure separating the first and second compartments, wherein the isolating structure comprises a material with a melting point of 60° C. to 80° C.