US 11,053,352 B2
Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board
Guangbin Chen, Guangdong (CN); Qianfa Liu, Guangdong (CN); Shanyin Yan, Guangdong (CN); Xianping Zeng, Guangdong (CN); and Cuiming Du, Guangdong (CN)
Assigned to SHENGYI TECHNOLOGY CO., LTD., Guangdong (CN)
Filed by Shengyi Technology Co., Ltd., Guangdong (CN)
Filed on Jul. 26, 2019, as Appl. No. 16/523,735.
Claims priority of application No. 201910108789.5 (CN), filed on Feb. 2, 2019.
Prior Publication US 2020/0247947 A1, Aug. 6, 2020
Int. Cl. C08K 9/04 (2006.01); C08G 65/329 (2006.01); C08F 236/06 (2006.01); C08J 5/24 (2006.01); C08K 3/38 (2006.01); C08K 5/14 (2006.01); C08K 7/26 (2006.01); C08L 53/02 (2006.01); C08F 8/02 (2006.01); C08F 8/46 (2006.01)
CPC C08G 65/329 (2013.01) [C08F 236/06 (2013.01); C08J 5/24 (2013.01); C08K 3/38 (2013.01); C08K 5/14 (2013.01); C08K 7/26 (2013.01); C08K 9/04 (2013.01); C08L 53/025 (2013.01); C08F 8/02 (2013.01); C08F 8/46 (2013.01); C08L 2203/20 (2013.01)] 17 Claims
 
1. A vinyl thermosetting resin composition, comprising the following components:
(1) a vinyl thermosetting resin;
(2) a curing agent; and
(3) hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin.