US 11,052,481 B2
Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching
Heather Debra Boek, Corning, NY (US); Andreas Simon Gaab, Grobenzell (DE); Garrett Andrew Piech, Corning, NY (US); Alranzo Boh Ruffin, Painted Post, NY (US); Daniel Arthur Sternquist, Horseheads, NY (US); and Michael Brian Webb, Lindley, NY (US)
Assigned to Corning Incorporated, Corning, NY (US)
Filed by CORNING INCORPORATED, Corning, NY (US)
Filed on Jan. 29, 2020, as Appl. No. 16/776,055.
Claims priority of provisional application 62/802,905, filed on Feb. 8, 2019.
Prior Publication US 2020/0254557 A1, Aug. 13, 2020
Int. Cl. B23K 26/00 (2014.01); B23K 26/362 (2014.01)
CPC B23K 26/009 (2013.01) [B23K 26/0006 (2013.01); B23K 26/362 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for processing a transparent workpiece, the method comprising:
directing a pulsed laser beam through an optical system and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a plurality of defects within the transparent workpiece thereby forming a damage line in the transparent workpiece that extends from a first surface of the transparent workpiece through at least a portion of a thickness of the transparent workpiece, the portion of the pulsed laser beam directed into the transparent workpiece comprising:
a wavelength λ;
a spot size w0; and
a Raleigh range ZR that is greater than

OG Complex Work Unit Math
where FD is a dimensionless divergence factor comprising a value of 10 or greater; and
etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.