US 11,052,436 B2
Laser cleaning apparatus and laser cleaning method
Chun-Ming Chen, Hsinchu (TW); Chien-Jung Huang, Hsinchu (TW); Yu-Chung Lin, Hsinchu (TW); Chieh-Ting Tseng, Hsinchu (TW); and Min-Kai Lee, Hsinchu (TW)
Filed on Sep. 17, 2018, as Appl. No. 16/133,199.
Claims priority of application No. 107112771 (TW), filed on Apr. 13, 2018.
Prior Publication US 2019/0314871 A1, Oct. 17, 2019
Int. Cl. B08B 7/00 (2006.01); B23K 26/064 (2014.01); B23K 26/06 (2014.01); B23K 26/067 (2006.01)
CPC B08B 7/0042 (2013.01) [B23K 26/067 (2013.01); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01)] 40 Claims
OG exemplary drawing
1. A laser cleaning apparatus for cleaning a test piece, comprising:
a laser module for providing a laser beam;
a laser beam regulating module including an energy compensator and a divergence angle optimizer, wherein
the divergence angle optimizer is configured for adjusting the laser beam into a collimated laser beam, and
the energy compensator is configured for compensating laser energy required by the laser beam based on a cleaning location of the test piece to form a compensated laser beam;
a wavelength switcher for switching a wavelength of the laser beam in accordance with process requirements;
at least an optical element for guiding the laser beam provided by the laser module to pass through at least one of the energy compensator and the divergence angle optimizer; and
an optical path propagating module and a nozzle with an opening disposed in a machine, wherein
the optical path propagating module is connected with a light guide arm for guiding the laser beam to pass through the opening of the nozzle to form a stabilized laser beam with a stable laser energy that aims at the cleaning location of the test piece inside a wafer prober for cleaning the test piece.