US 11,052,422 B2
Electronic component manufacturing method and apparatus
Eiji Sato, Tokyo (JP); and Hitoshi Sakamoto, Nagaoka (JP)
Assigned to Creative Coatings Co., Ltd., Tokyo (JP)
Filed by Creative Coatings Co., Ltd., Tokyo (JP)
Filed on Jul. 3, 2019, as Appl. No. 16/503,288.
Claims priority of application No. JP2018-130961 (JP), filed on Jul. 10, 2018; and application No. JP2018-168952 (JP), filed on Sep. 10, 2018.
Prior Publication US 2020/0016624 A1, Jan. 16, 2020
Int. Cl. B05D 1/00 (2006.01); B05D 1/18 (2006.01); H01G 13/00 (2013.01); H01C 17/28 (2006.01); H05K 1/18 (2006.01); B05C 3/09 (2006.01); B05C 13/02 (2006.01); H01G 2/06 (2006.01); H01G 4/005 (2006.01)
CPC B05D 1/18 (2013.01) [B05C 3/09 (2013.01); B05C 13/02 (2013.01); H01C 17/28 (2013.01); H01G 2/06 (2013.01); H01G 4/005 (2013.01); H01G 13/006 (2013.01); H05K 1/185 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component manufacturing method comprising:
blotting by bringing a conductive paste applied to an end portion including an end face of an electronic component body held by a jig into contact with a surface of a surface plate, thereby transferring extra conductive paste to the surface plate,
the blotting including simultaneous performance of:
distance changing of changing a distance between the end face of the electronic component body and the surface of the surface plate, and
position changing of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the movement direction of the two-dimensional position successively varies on the surface of the surface plate,
wherein in the position changing, the movement locus of the two-dimensional position draws a loop, and in the blotting, the electronic component body is spirally moved relative to the surface of the surface plate.