US 11,052,109 B2
Methods of treatment using topical copper ion formulations
Dominic C. Abbott, Pittsburgh, PA (US); and ChunLim Abbott, Pittsburgh, PA (US)
Assigned to CDA RESEARCH GROUP, INC., Pittsburgh, PA (US)
Filed by CDA Research Group, Inc., Pittsburgh, PA (US)
Filed on Sep. 14, 2016, as Appl. No. 15/265,570.
Application 15/265,570 is a continuation in part of application No. 13/841,882, filed on Mar. 15, 2013.
Application 13/841,882 is a continuation in part of application No. 13/841,992, filed on Mar. 15, 2013.
Application 13/841,992 is a continuation in part of application No. 13/842,387, filed on Mar. 15, 2013.
Application 13/842,387 is a continuation in part of application No. 13/842,310, filed on Mar. 15, 2013.
Prior Publication US 2017/0000823 A1, Jan. 5, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. A61K 33/34 (2006.01); A61K 8/19 (2006.01); A61Q 11/00 (2006.01); A61Q 17/00 (2006.01); A61K 9/00 (2006.01); A61K 9/02 (2006.01); A61K 9/06 (2006.01); A61K 9/12 (2006.01); A01M 31/00 (2006.01); A61K 9/08 (2006.01); A61K 9/10 (2006.01); A61K 9/70 (2006.01)
CPC A61K 33/34 (2013.01) [A01M 31/00 (2013.01); A61K 8/19 (2013.01); A61K 9/006 (2013.01); A61K 9/0014 (2013.01); A61K 9/0031 (2013.01); A61K 9/0034 (2013.01); A61K 9/0036 (2013.01); A61K 9/0043 (2013.01); A61K 9/0046 (2013.01); A61K 9/02 (2013.01); A61K 9/06 (2013.01); A61K 9/08 (2013.01); A61K 9/10 (2013.01); A61K 9/12 (2013.01); A61K 9/122 (2013.01); A61K 9/7084 (2013.01); A61Q 11/00 (2013.01); A61Q 17/005 (2013.01)] 49 Claims
 
1. A pharmaceutically acceptable formulation for use in treating a condition causing pain and/or swelling of a joint of a subject, the pharmaceutically acceptable formulation consisting of:
(a) a carrier consisting of a liquid phase and a soluble phase, the liquid phase comprising about 5 μg/mL to about 15 μg/mL copper ions; and
(b) a copper ion-containing suspension consisting of:
(i) a saline solution;
(ii) one or more buffers; and
(iii) copper ions,
wherein the copper ions are a result of:
(A) placing a solid copper metal of 99.5% or greater copper content into the saline solution;
(B) allowing the solid copper metal to remain in the saline solution for a predetermined period of time; and
(C) removing the solid copper metal from the saline solution, thereby disposing the copper ions in the saline solution.