US 12,349,604 B2
Technologies for radio frequency optimized interconnects for a quantum processor
Hubert C. George, Highlands Ranch, CO (US); Ravi Pillarisetty, Portland, OR (US); Jongseok Park, Hillsboro, OR (US); Stefano Pellerano, Beaverton, OR (US); Lester F. Lampert, Portland, OR (US); Thomas F. Watson, Portland, OR (US); Florian Luethi, Portland, OR (US); and James S. Clarke, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2021, as Appl. No. 17/561,439.
Prior Publication US 2023/0210023 A1, Jun. 29, 2023
Int. Cl. H10N 60/10 (2023.01); G06N 10/80 (2022.01); H01P 3/00 (2006.01); H03H 7/38 (2006.01); H10N 60/01 (2023.01); H10N 60/81 (2023.01); H10N 69/00 (2023.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01)
CPC H10N 69/00 (2023.02) [G06N 10/80 (2022.01); H01P 3/003 (2013.01); H03H 7/38 (2013.01); H10N 60/01 (2023.02); H10N 60/11 (2023.02); H10N 60/128 (2023.02); H10N 60/81 (2023.02); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45186 (2013.01); H01L 2224/48153 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/0495 (2013.01); H05K 1/18 (2013.01); H05K 2201/10045 (2013.01); H05K 2201/10522 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A quantum processor die comprising:
a plurality of spin qubits;
a plurality of waveguides on a surface of the quantum processor die to deliver signals to and from the plurality of spin qubits, wherein individual waveguides of the plurality of waveguides comprise a center signal conductor and two ground conductors; and
a metallic structure surrounding, without gaps, the plurality of waveguides, wherein the two ground conductors of individual waveguides of the plurality of waveguides are connected to the metallic structure.