US 12,349,596 B2
Vibration device
Keisuke Teranishi, Tokyo (JP); Hiroki Mitsui, Tokyo (JP); Miho Kato, Tokyo (JP); Hideya Sakamoto, Tokyo (JP); and Narumi Sato, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Nov. 22, 2021, as Appl. No. 17/531,976.
Claims priority of application No. 2020-216835 (JP), filed on Dec. 25, 2020.
Prior Publication US 2022/0209096 A1, Jun. 30, 2022
Int. Cl. H01L 41/047 (2006.01); H10N 30/20 (2023.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01)
CPC H10N 30/875 (2023.02) [H10N 30/204 (2023.02); H10N 30/88 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A vibration device comprising:
a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element;
a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal;
a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element; and
a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member from the main surface side of the piezoelectric element;
wherein the second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer, and
wherein the second resin layer is thinner than the wiring member.