US 12,349,524 B2
Semiconductor light source device of optical integrated packaging
Wei Huang, Shenzhen (CN); Yuxing Cao, Shenzhen (CN); and Yang Wang, Dublin, CA (US)
Filed by Shenzhen Raysees AI Technology Co., Ltd., Shenzhen (CN)
Filed on Jun. 2, 2021, as Appl. No. 17/336,414.
Claims priority of application No. 202010502212.5 (CN), filed on Jun. 4, 2020.
Prior Publication US 2021/0384390 A1, Dec. 9, 2021
Int. Cl. H10H 20/855 (2025.01); H10H 20/80 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01); H10H 20/858 (2025.01); H10H 20/01 (2025.01)
CPC H10H 20/855 (2025.01) [H10H 20/8514 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01); H10H 20/882 (2025.01)] 5 Claims
OG exemplary drawing
 
1. A semiconductor light source device of optical integrated packaging (10), wherein, comprises a substrate (100), an optical lens (200), a LED chip (400) and a light transmitting glue layer (500), and a wire (700),
the substrate (100) is provided with a circuit (300), the optical lens (200) is fixed upon the substrate (100), an outer bottom part of the optical lens (200) having an outer surface contacts and is above and sealedly connected with the substrate (100), a part of a section of a side of the optical lens (200) and a part of a section of a side of the substrate (100) are formed by dicing or laser cutting and in a same plane, the LED chip (400) is electrically connected with a first portion of the circuit (300), the wire (700) is partly coated with the light transmitting glue layer (500) and electrically connected with a second portion of the circuit (300) and the LED chip (400) respectively, and an inner bottom part of the optical lens (200) having an inner surface is above and fixed with the first and second portions of the circuit (300) respectively; a light source cavity (600) is provided between the optical lens (200) and the substrate (100); the LED chip (400) and the light transmitting glue layer (500) are respectively accommodated in the light source cavity (600); the LED chip (400) is arranged on top of the circuit (300) and electrically connected with the circuit (300); a side surface of the LED chip (400) is exposed in the light source cavity (600); the light transmitting glue layer is arranged on an upper surface of the LED chip (400) and not on the side surface of the LED chip (400); the light transmitting glue layer (500) is used to reduce Fresnel loss when light of the LED chip (400) is taken out; an outer surface of the light transmitting glue layer (500) is a convex surface which is used to reduce total reflection loss of the light emitted by the LED chip (400); a curvature of the convex surface is matched with a shape and a size of the LED chip (400), which is used to reduce the total reflection loss by increasing a total reflection angle; a lower side of the light transmitting glue layer (500) is configured to deflect by refraction part of the light emitted by the LED chip (400) towards a top of the LED chip (400) for reducing a side light emission angle of the LED chip (400), and the wire (700) is arranged to pass through the lower side of the light transmitting glue layer (500).