US 12,349,409 B2
Semiconductor device having a gate contact on a low-k liner
Meng-Huan Jao, Hsinchu (TW); Huan-Chieh Su, Hsinchu (TW); Yi-Bo Liao, Hsinchu (TW); Cheng-Chi Chuang, Hsinchu (TW); Jin Cai, Hsinchu (TW); and Chih-Hao Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Mar. 15, 2022, as Appl. No. 17/695,605.
Claims priority of provisional application 63/230,511, filed on Aug. 6, 2021.
Prior Publication US 2023/0039440 A1, Feb. 9, 2023
Int. Cl. H10D 30/00 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 62/83 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 64/62 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 30/6757 (2025.01); H10D 62/118 (2025.01); H10D 62/83 (2025.01); H10D 64/01 (2025.01); H10D 64/258 (2025.01); H10D 64/62 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate;
a channel region of a transistor overlying the substrate;
a source/drain region in contact with the channel region, the source/drain region adjacent to the channel region along a first direction;
a source/drain contact on the source/drain region;
a dielectric liner layer lining a sidewall of the source/drain contact;
a gate electrode on the channel region;
a gate dielectric layer on the gate electrode;
a gate contact on the gate electrode;
a gate spacer dielectric layer between the gate electrode and the dielectric liner layer; and
a first dielectric layer in contact with a top surface of the gate spacer dielectric layer, in contact with the dielectric liner layer above the gate spacer dielectric layer, and in contact with a sidewall of the gate contact.