| CPC H05K 9/0022 (2013.01) [H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H05K 1/023 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10522 (2013.01)] | 20 Claims |

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1. A module comprising:
a substrate having an upper main surface and a lower main surface arranged in an up-down direction;
a first metal member including a first plate-shaped portion provided on the upper main surface of the substrate, the first plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction;
a first electronic component mounted on the upper main surface of the substrate and disposed in front of the first metal member;
a second electronic component mounted on the upper main surface of the substrate and disposed behind the first metal member; and
a sealing resin layer provided on the upper main surface of the substrate and covering the first metal member, the first electronic component, and the second electronic component,
wherein
the first metal member further includes a first left support portion,
a boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary,
the first left boundary is located on a left part of the first metal member,
the first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located in front of or behind the first plate-shaped portion,
a lower end of the first plate-shaped portion and a lower end of the first left support portion are fixed to the substrate, and
a first left lower notch extending in an upward direction from the lower end of the first plate-shaped portion and the lower end of the first left support portion is provided such that a lower end of the first left boundary is located above the lower end of the first plate-shaped portion and the lower end of the first left support portion.
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