US 12,349,317 B2
Electronic assembly having thermal pad with polymer layer
Steven Nedved, Littleton, CO (US); Morgan Kirby, Palmer Lake, CO (US); Svitlana Trygubova, Lakewood, CO (US); and Henry Gregg Martch, Parker, CO (US)
Assigned to DISH Network L.L.C., Englewood, CO (US)
Filed by DISH Network L.L.C., Englewood, CO (US)
Filed on Apr. 26, 2022, as Appl. No. 17/729,174.
Prior Publication US 2023/0345675 A1, Oct. 26, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20454 (2013.01) [H05K 7/20445 (2013.01); H05K 7/20472 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic assembly, comprising:
a heat-spreader component;
at least one spring coupled to the heat-spreader component;
a thermal pad having a first surface and a second surface that is opposite the first surface; and
at least one layer of polymer directly contacting the first surface of the thermal pad,
wherein:
the at least one layer of polymer is not adhesive to components of the electronic assembly,
the second surface of the thermal pad is exposed and is adhesive to components of the electronic assembly,
the thermal pad is disposed on the at least one spring such that the at least one layer of polymer directly contacts the at least one spring, and
in use of the electronic assembly, the at least one layer of polymer remains directly contacting the at least one spring.