US 12,349,278 B2
Self-guided placement of memory device component packages
Uthayarajan A/L Rasalingam, Nibong Tebal (MY); and Alexander Beh, Nibong Tebal (MY)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Nov. 16, 2021, as Appl. No. 17/527,687.
Prior Publication US 2023/0156921 A1, May 18, 2023
Int. Cl. H05K 1/18 (2006.01); H01L 23/00 (2006.01)
CPC H05K 1/181 (2013.01) [H01L 24/16 (2013.01); H01L 2224/10135 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1438 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10159 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A data storage device, comprising:
a substrate; and
an integrated circuit package including:
a grid array, and
at least one self-correcting alignment pin having a tapered portion; and
wherein the substrate includes a connection pad interfacing with the integrated circuit package, the connection pad including at least one self-correcting alignment receptacle receiving the at least one self-correcting alignment pin,
wherein the self-correcting alignment receptacle has a tapered shape complementary to a shape of the tapered portion of the at least one self-correcting alignment pin, and
wherein the self-correcting alignment receptacle does not penetrate completely through the substrate.