US 12,349,276 B2
Co-planar interconnection mechanisms for circuit boards
Mooi Ling Chang, Bayan Lepas (MY); Tin Poay Chuah, Bayan Baru (MY); Eng Huat Goh, Ayer Itam (MY); Min Suet Lim, Gelugor (MY); and Twan Sing Loo, Butterworth (MY)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Feb. 14, 2022, as Appl. No. 17/671,566.
Prior Publication US 2022/0174820 A1, Jun. 2, 2022
Int. Cl. H05K 1/14 (2006.01); G06F 13/40 (2006.01); H01R 12/51 (2011.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/141 (2013.01) [G06F 13/4022 (2013.01); G06F 13/4068 (2013.01); H01R 12/51 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 2201/10189 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a circuit board comprising circuitry; and
fins extending from at least one outer edge of the circuit board, wherein a thickness of the fins is less than a thickness of the circuit board, the fins comprise electrical connectors connected to the circuitry of the circuit board, and the fins are shaped to provide an interlocking connection with another circuit board in the planar direction of the circuit board.