US 12,349,271 B2
Flexible printed circuit board assembly and electronic device including the same
Bumhee Bae, Suwon-si (KR); Younghun Seong, Suwon-si (KR); Jaehoon Lee, Suwon-si (KR); and Jeongnam Cheon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 13, 2023, as Appl. No. 18/096,844.
Application 18/096,844 is a continuation of application No. PCT/KR2021/009649, filed on Jul. 26, 2021.
Claims priority of application No. 10-2020-0093906 (KR), filed on Jul. 28, 2020.
Prior Publication US 2023/0171881 A1, Jun. 1, 2023
Int. Cl. H05K 1/02 (2006.01); B32B 3/08 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/26 (2006.01); B32B 27/36 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 9/00 (2006.01); G06F 1/16 (2006.01)
CPC H05K 1/028 (2013.01) [H05K 1/0272 (2013.01); H05K 1/181 (2013.01); G06F 1/1652 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A flexible printed circuit board (FPCB) assembly comprising:
an electrically conductive layer configured to transmit a signal;
a dielectric layer provided on the electrically conductive layer;
a ground layer provided on the dielectric layer;
an auxiliary metal layer provided under the ground layer, and connecting a plurality of regions of the ground layer to each other; and
a ground protecting layer provided on the auxiliary metal layer with the ground layer therebetween,
wherein the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible, and
wherein the ground protecting layer comprises a perforated region in which a degassing hole penetrating through the ground protecting layer in a vertical direction is formed.