| CPC H04N 23/90 (2023.01) [G01B 11/245 (2013.01); H04N 23/54 (2023.01); H04N 23/695 (2023.01)] | 17 Claims |

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1. An inspection system comprising
a digital camera subsystem,
wherein the digital camera subsystem comprises an array of multiple micro-cameras mounted on a printed circuit board,
wherein each micro-camera comprises a digital image sensor and a lens system that is configured to image a fraction of an item at an image resolution of 20 micrometers or smaller, and
wherein the digital camera subsystem is configured to detect optical radiation over a field-of-view of 100 mm or more in a diagonal dimension in a single snapshot,
wherein the printed circuit board comprises a steering device coupled to a sensor of at least a micro-camera of the multiple micro-cameras, with the steering device configured to move the sensor axially to change a plane of focus of the at least a micro-camera;
a control subsystem configured to control an image data acquisition process by the digital camera subsystem.
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