| CPC H02B 1/04 (2013.01) [B64D 33/00 (2013.01); H02B 1/24 (2013.01); H02M 7/003 (2013.01); H05K 1/181 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10166 (2013.01)] | 19 Claims |

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1. A modular power overlay architecture, comprising:
a first set of power overlay tiles defining a substantially planar arrangement of power switching components arranged on a first substrate and defining a first planar footprint;
a second set of power overlay tiles defining a substantially planar arrangement of power switching components arranged on a second substrate and defining a second planar footprint, the second planar footprint equal to the first planar footprint; and
a housing configured to receive the first set of power overlay tiles and the second set of power overlay tiles in a parallel arrangement where the first planar footprint and second planar footprint are in an overlying arrangement;
wherein each tile of the first set of power overlay tiles defines a first end having a set of terminals, and wherein each tile of the second set of power overlay tiles defines a first end having a set of terminals, and wherein each terminal of the set of terminals includes a first conductive layer, a second conductive layer, and a non-conductive layer separating the first conductive layer from the second conductive layer.
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