US 12,347,978 B2
Overmold-overmold micro radio frequency connector
Ian E. Nord, Dallas, TX (US); Joseph P. Nipper, Allen, TX (US); and Mikel J. White, Murphy, TX (US)
Assigned to RAYTHEON COMPANY, Waltham, MA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Jul. 18, 2022, as Appl. No. 17/866,926.
Prior Publication US 2024/0022027 A1, Jan. 18, 2024
Int. Cl. H01R 13/00 (2006.01); H01R 12/71 (2011.01); H01R 13/50 (2006.01); H01R 13/6588 (2011.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01); H01R 13/6599 (2011.01)
CPC H01R 13/6588 (2013.01) [H01R 12/716 (2013.01); H01R 13/50 (2013.01); H01R 43/205 (2013.01); H01R 43/24 (2013.01); H01R 13/6599 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An overmold-overmold connector, comprising:
one or more radio frequency (RF) signal pins;
ground pins
arranged in a ring-shape around the one or more RF signal pins;
a ground pin supporting mold formed about the ground pins and defining a borehole around the one or more RF signal pins; and
a dielectric mold formed in the borehole about the one or more RF signal pins and about the ground pin supporting mold.