US 12,347,911 B2
Filter with adhesively bonded filter patterns and manufacturing method thereof
Shang-Hua Yang, Hsinchu (TW); and Yi-Chun Hung, Hsinchu (TW)
Assigned to National Tsing Hua University, Hsinchu (TW)
Filed by National Tsing Hua University, Hsinchu (TW)
Filed on Dec. 16, 2022, as Appl. No. 18/082,579.
Claims priority of application No. 111118691 (TW), filed on May 19, 2022.
Prior Publication US 2023/0378623 A1, Nov. 23, 2023
Int. Cl. H01P 1/203 (2006.01); H01P 1/20 (2006.01); H01P 11/00 (2006.01)
CPC H01P 1/203 (2013.01) [H01P 1/20 (2013.01); H01P 11/003 (2013.01); H01P 11/007 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A filter, comprising:
a substrate; and
a filter structure, wherein the filter structure forms a filter pattern on a surface of the substrate, and the filter structure comprises:
an adhesive layer coupled to the substrate; and
a conductive layer, coupled to the adhesive layer, comprising a first covering part,
wherein the first covering part of the conductive layer is attached to the adhesive layer,
wherein the adhesive layer is attached to the surface of the substrate according to the filter pattern, and the first covering part of the conductive layer is attached to the adhesive layer to form the filter pattern.