US 12,347,813 B2
Semiconductor package and related methods
Chee Hiong Chew, Seremban (MY); Erik Nino Tolentino, Seremban (MY); Vemmond Jeng Hung Ng, Senawang (MY); and Shutesh Krishnan, Seremban (MY)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Oct. 19, 2023, as Appl. No. 18/490,270.
Application 18/490,270 is a division of application No. 16/745,762, filed on Jan. 17, 2020, granted, now 11,830,856.
Claims priority of provisional application 62/814,366, filed on Mar. 6, 2019.
Prior Publication US 2024/0072009 A1, Feb. 29, 2024
Int. Cl. H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 25/072 (2013.01) [H01L 23/3735 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/4001 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/4052 (2013.01); H01L 2224/40991 (2013.01); H01L 2224/8484 (2013.01); H01L 2224/84931 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor package comprising:
applying sintering material over one of a first side of a plurality of die or a first side of a clip;
applying sintering material to one of a first side of an electrically conductive spacer or the clip;
pressure sintering the electrically conductive spacer and plurality of die to the clip through the sintering material;
applying sintering material to one of a the second side of the plurality of die or a substrate, the second side of the plurality of die opposite the first side of the plurality of die;
applying sintering material to one of a second side of the electrically conductive spacer or the substrate, the second side opposite the first side of the electrically conductive spacer; and
pressure sintering the substrate to the electrically conductive spacer and plurality of die through the sintering material.