US 12,347,812 B2
Low stress asymmetric dual side module
Chee Hiong Chew, Seremban (MY); Atapol Prajuckamol, Thanyaburi (TH); Stephen St. Germain, Gilbert, AZ (US); and Yusheng Lin, Phoenix, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Dec. 28, 2023, as Appl. No. 18/398,499.
Application 17/823,164 is a division of application No. 16/678,039, filed on Nov. 8, 2019, granted, now 11,462,515, issued on Oct. 4, 2022.
Application 18/398,499 is a continuation of application No. 17/823,164, filed on Aug. 30, 2022, granted, now 11,908,840.
Claims priority of provisional application 62/882,119, filed on Aug. 2, 2019.
Prior Publication US 2024/0290758 A1, Aug. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01)
CPC H01L 25/071 (2013.01) [H01L 23/367 (2013.01); H01L 24/32 (2013.01); H01L 25/50 (2013.01); H01L 2224/32245 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor package, the method comprising:
providing a first panel of first substrates and a second panel of second substrates;
printing a first sintering material on a first side of the first panel of first substrates and a first side of the second panel of second substrates in predetermined locations;
coupling two or more die to each substrate of the first panel of first substrates and to each substrate of the second panel of second substrates at the predetermined locations;
dispensing a second sintering material onto a second side of each of the two or more die;
coupling a plurality of clips to each of the two or more die;
electrically coupling the two or more die to each substrate of the first panel of first substrates and to each substrate of the second panel of second substrates;
singulating each of the first panel and the second panel into a plurality of first substrates and a plurality of second substrates, respectively;
dispensing solder onto a plurality of predetermined locations on the first side of each of the plurality of first substrates and each of the plurality of second substrates;
coupling a first substrate of the plurality of first substrates to a first side of a lead frame;
coupling two or more spacers to a first side of the first substrate; and
coupling a first side of a second substrate of the plurality of second substrates to the two or more spacers and to the second side of the lead frame.