US 12,347,811 B2
Electronic device including electronic component receiving power from two sides
Chun-Yen Ting, Kaohsiung (TW); Pao-Nan Lee, Kaohsiung (TW); Jung Jui Kang, Kaohsiung (TW); and Chang Chi Lee, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jun. 22, 2022, as Appl. No. 17/846,642.
Prior Publication US 2023/0420418 A1, Dec. 28, 2023
Int. Cl. H01L 25/065 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 2225/06544 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06589 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first die; and
a second die disposed over the first die and having a backside surface facing a backside surface of the first die,
wherein an active surface of the second die is configured to receive a first power, the second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die,
wherein a density of a plurality of terminals located at an active surface of the first die is greater than a density of a plurality of terminals located at the active surface of the second die.