US 12,347,795 B2
Semiconductor package including uneven structures and electronic device including the same
Bonggyu Kang, Yongin-si (KR); Yongha Kim, Seongnam-si (KR); Youngsoo Jang, Suwon-si (KR); Heesu Kim, Suwon-si (KR); Kwangsoo Park, Suwon-si (KR); and Junsik Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 19, 2022, as Appl. No. 17/659,778.
Claims priority of application No. 10-2021-0105596 (KR), filed on Aug. 10, 2021.
Prior Publication US 2023/0048277 A1, Feb. 16, 2023
Int. Cl. H01L 23/60 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/60 (2013.01) [H01L 23/3675 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30201 (2013.01); H01L 2924/30205 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a package board;
at least one semiconductor chip disposed on the package board;
a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip; and
a heat dissipation member disposed on the at least one semiconductor chip and the molding member, and including an outward surface including a first region in which a plurality of uneven structures is disposed, and a second region,
wherein each of the plurality of uneven structures protrudes to a predetermined height in an outward direction away from the at least one semiconductor chip and the molding member, and is spaced apart from a proximate structure of the plurality of uneven structures in a first direction and a second direction,
wherein the first direction and the second direction are each parallel to the upper surface of the package board,
wherein the semiconductor package is disposed on an electric field plate and the predetermined height of each of the plurality of uneven structures affects a spacing between the heat dissipation member and the electric field plate.