US 12,347,788 B2
Glass substrates having signal shielding for use with semiconductor packages and related methods
Kristof Darmawikarta, Chandler, AZ (US); Srinivas V. Pietambaram, Chandler, AZ (US); Kemal Aygun, Tempe, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); Zhiguo Qian, Chandler, AZ (US); and Jiwei Sun, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 24, 2021, as Appl. No. 17/485,045.
Prior Publication US 2023/0103183 A1, Mar. 30, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a core layer including:
a first channel partially extending through a first surface of the core layer;
a second channel partially extending through a second surface of the core layer opposite the first surface, the second channel spaced from the first channel to provide a separation within the core layer between the first channel and the second channel; and
a through glass via (TGV), the first channel and the second channel at least partially surrounding the TGV;
a signal transmission line in the TGV and extending through the core layer; and
an electrically conductive material in the first channel and the second channel, the electrically conductive material to provide electromagnetic shielding to the signal transmission line.