US 12,347,784 B2
Interposer with step feature
Florence Pon, Folsom, CA (US); and Yi Xu, Folsom, CA (US)
Assigned to SK Hynix NAND Product Solutions Corp., Rancho Cordova, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 27, 2019, as Appl. No. 16/365,811.
Prior Publication US 2020/0312769 A1, Oct. 1, 2020
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5386 (2013.01) [H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An interposer apparatus comprising:
a first side;
a second side adjacent to and substantially perpendicular to a first plane of the first side, wherein the second side includes a plurality of step features that include: a first face in a second plane substantially parallel to the first plane of the first side, a second face with a third plane substantially perpendicular to the first plane of the first face, and wherein the first face and the second face meet to form a step feature;
wherein the first face of a first step feature of the plurality of step features is to couple with a first die;
wherein the first face of a second step feature of the plurality of step features is to couple with a second die;
a first electrical connector to couple to the first die, the first electrical connector in the interposer apparatus;
a second electrical connector to couple to the second die, the second electrical connector in the interposer apparatus; and
electrical routing disposed in the interposer apparatus to electrically couple the first electrical connector directly to the second electrical connector within the interposer apparatus.