US 12,347,782 B2
Microelectronic assemblies with direct attach to circuit boards
Sanka Ganesan, Chandler, AZ (US); William J. Lambert, Chandler, AZ (US); Bharat Prasad Penmecha, Phoenix, AZ (US); and Xavier Francois Brun, Hillsboro, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 15, 2021, as Appl. No. 17/476,301.
Prior Publication US 2023/0082706 A1, Mar. 16, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5385 (2013.01) [H01L 23/3107 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2224/26152 (2013.01); H01L 2224/32137 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49096 (2013.01); H01L 2224/49174 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a first redistribution layer (RDL), having a first surface, an opposing second surface, and first conductive pathways between the first and second surfaces, wherein the first surface of the first RDL includes first conductive contacts having a first pitch between 170 microns and 400 microns;
a first die in a first layer, wherein the first layer is on the second surface of the first RDL;
a conductive pillar in the first layer;
a second RDL on the first layer, the second RDL having a first surface, an opposing second surface, and second conductive pathways between the first and second surfaces, wherein the second surface of the second RDL includes second conductive contacts having a second pitch between 18 microns and 150 microns; and
a second die, in a second layer on the second RDL, wherein the second die is electrically coupled to the second conductive contacts and electrically coupled to the first conductive contacts via the first conductive pathways in the first RDL, the conductive pillar, the second conductive pathways in the second RDL, and the second conductive contacts.