US 12,347,771 B2
Semiconductor device having fuse array and method of making the same
Meng-Sheng Chang, Hsinchu (TW); Shao-Yu Chou, Hsinchu (TW); Po-Hsiang Huang, Hsinchu (TW); An-Jiao Fu, Hsinchu (TW); and Chih-Hao Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Mar. 13, 2023, as Appl. No. 18/182,760.
Application 17/587,716 is a division of application No. 16/573,761, filed on Sep. 17, 2019, granted, now 11,257,757, issued on Feb. 22, 2022.
Application 18/182,760 is a continuation of application No. 17/587,716, filed on Jan. 28, 2022, granted, now 11,626,368.
Prior Publication US 2023/0215804 A1, Jul. 6, 2023
Int. Cl. H01L 23/525 (2006.01); G06F 30/39 (2020.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/52 (2006.01); G06F 119/18 (2020.01)
CPC H01L 23/5256 (2013.01) [G06F 30/39 (2020.01); H01L 21/76892 (2013.01); H01L 23/573 (2013.01); G06F 2119/18 (2020.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a component;
a first fuse electrically between the component and a signal source, wherein the first fuse is a first distance from the component, the first fuse comprises a fuse material, and the first fuse has a fuse dimension;
a conductive line electrically between the component and the first fuse, wherein the conductive line has a first dimension and a first material, and at least one of the following conditions is satisfied:
the fuse dimension is different from the first dimension, or
the fuse material is different from the first material; and
a second fuse electrically connected to the component, wherein the second fuse is a second distance from the component, the second distance is different from the first distance, the second fuse electrically connects the signal source to a dummy interconnect structure, and the dummy interconnect structure is external to the second fuse.
 
14. A semiconductor device, comprising:
a component;
a first fuse electrically between the component and a signal source, wherein the first fuse is a first distance from the component;
a second fuse electrically connected to the component, wherein the second fuse is a second distance from the component, the second distance is different from the first distance, the second fuse has a dimension less than a conductive line on a same metal level, and the second fuse is incapable of providing an electrical path between the component and the signal source;
a first interconnect structure;
a second interconnect structure, wherein the first fuse electrically connects the first interconnect structure to the second interconnect structure; and
a third interconnect structure, wherein the second fuse electrically connects the second interconnect structure to the third interconnect structure.