US 12,347,762 B2
Method and apparatus for through interposer die level interconnect with thermal management
Reginald D. Bean, Center Point, IA (US)
Assigned to Rockwell Collin Inc., Cedar Rapids, IA (US)
Filed by Rockwell Collins, Inc., Cedar Rapids, IA (US)
Filed on Jul. 9, 2021, as Appl. No. 17/371,723.
Application 17/371,723 is a continuation in part of application No. 17/178,971, filed on Feb. 18, 2021, granted, now 11,621,219.
Prior Publication US 2022/0262714 A1, Aug. 18, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A system comprising:
an electronic assembly comprising:
an interposer comprising:
a first attachment layer;
a second attachment layer;
a first interposer redistribution layer electrically coupled to the first attachment layer;
a second interposer redistribution layer electrically coupled to the second attachment layer;
at least one of a thermal spreader layer or a thermal management layer;
an interposer cavity; and
an interconnect header disposed within the interposer cavity comprising a plurality of interconnect filaments configured to electrically couple at least one of the first interposer redistribution layer or the second interposer redistribution layer.