US 12,347,761 B2
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate
Aleksandar Aleksov, Chandler, AZ (US); Neelam Prabhu Gaunkar, Chandler, AZ (US); Georgios C. Dogiamis, Chandler, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); Veronica Strong, Hillsboro, OR (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 17, 2021, as Appl. No. 17/350,818.
Prior Publication US 2022/0406698 A1, Dec. 22, 2022
Int. Cl. H01L 23/498 (2006.01); H01F 27/28 (2006.01); H01L 21/48 (2006.01); H01L 23/58 (2006.01)
CPC H01L 23/49827 (2013.01) [H01F 27/2804 (2013.01); H01L 21/486 (2013.01); H01L 23/58 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A package substrate, comprising:
a core;
a conductive via through a thickness of the core; and
a shell surrounding a perimeter of the conductive via, wherein the shell is a magnetic material, and wherein a surface of the conductive via is laterally spaced apart from the shell by a portion of the core.