US 12,347,750 B2
Tip connection portion of terminal member and associated semiconductor device
Soichiro Umeda, Saitama (JP); and Atsushi Kyutoku, Saitama (JP)
Assigned to SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo (JP)
Filed by SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo (JP)
Filed on Jul. 5, 2022, as Appl. No. 17/857,261.
Claims priority of application No. 2021-115198 (JP), filed on Jul. 12, 2021.
Prior Publication US 2023/0007986 A1, Jan. 12, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49517 (2013.01) [H01L 23/3107 (2013.01); H01L 23/4924 (2013.01); H01L 24/29 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2924/014 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A terminal member connected to a connection target portion, the terminal member and formed of plate material, comprising:
a bent portion bent toward the connection target portion; and
a tip connection portion provided at a tip part of the bent portion and being a cross section formed by being punched out in a press processing in a direction of a plate thickness,
wherein the tip connection portion is connected to the connection target portion via a conductive bonding material;
wherein the tip connection portion is formed in a curved surface shape and is in linear contact with the connection target portion, and
wherein the bent portion is bent with a curvature center line as a bending center, and a location that is in linear contact with a conductor portion on the tip connection portion extends in a direction orthogonal to the curvature center line.