US 12,347,746 B2
Heat dissipation device
Cheng-Ju Chang, New Taipei (TW); Wan-Hsuan Lin, New Taipei (TW); and Chung-Chien Su, New Taipei (TW)
Assigned to AURAS TECHNOLOGY CO., LTD., New Taipei (TW)
Filed by Auras Technology Co., Ltd., New Taipei (TW)
Filed on Mar. 20, 2023, as Appl. No. 18/186,641.
Claims priority of provisional application 63/323,298, filed on Mar. 24, 2022.
Prior Publication US 2023/0307317 A1, Sep. 28, 2023
Int. Cl. H01L 23/427 (2006.01); F28F 1/12 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/427 (2013.01) [F28F 1/12 (2013.01); H01L 23/4006 (2013.01); H05K 7/20336 (2013.01); H05K 7/20509 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
a main fixed base plate;
a main heat pipe set fixed on the main fixed base plate;
a lower heat dissipation fin set fixed on the main fixed base plate, and the main heat pipe set passing through the lower heat dissipation fin set and exposed on the lower heat dissipation fin set;
an upper heat dissipation module detachably installed on the lower heat dissipation fin set and contacting the main heat pipe set;
an upper main heat dissipation fin set;
at least one auxiliary heat dissipation fin set disposed on a side of the upper main heat dissipation fin set;
a first auxiliary heat dissipation fin set and a second auxiliary heat dissipation fin set respectively disposed on two sides of the upper main heat dissipation fin set, and a thickness of the upper main heat dissipation fin set is less than or equal to a thickness of the first auxiliary heat dissipation fin set and a thickness of the second auxiliary heat dissipation fin set; and
an upper heat pipe set passing through the first auxiliary heat dissipation fin set, the upper main heat dissipation fin set and the second auxiliary heat dissipation fin set.