US 12,347,738 B2
Sensor package cavities with polymer films
Sreenivasan Kalyani Koduri, Dallas, TX (US); and Leslie Edward Stark, Heath, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Sep. 30, 2022, as Appl. No. 17/937,194.
Application 17/937,194 is a division of application No. 17/125,487, filed on Dec. 17, 2020, granted, now 11,476,175.
Prior Publication US 2023/0030266 A1, Feb. 2, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 23/29 (2006.01)
CPC H01L 23/3171 (2013.01) [H01L 23/293 (2013.01); H01L 23/315 (2013.01)] 36 Claims
OG exemplary drawing
 
1. A sensor package, comprising:
a semiconductor die;
a sensor on the semiconductor die, the sensor being arranged in its entirety within a periphery of the semiconductor die;
a mold compound covering the semiconductor die, the mold compound including a sensor cavity over the sensor; and
a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity, the polymer film member exposed to an exterior environment of the sensor package, the polymer film member covering an underlying portion of an upper surface of the sensor within an area defined by an opening of the sensor cavity.