US 12,347,733 B2
Die separation ring for wafers having a large die aspect ratio
Shuo Li, Shanghai (CN); Xiangyang Liu, Shanghai (CN); Xiaodong Liu, Shanghai (CN); Xuri Xin, Shanghai (CN); Weiting Jiang, Shanghai (CN); Zhenghao Wu, Shenzhen (CN); and Bo Yang, Dublin, CA (US)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Sandisk Technologies, Inc., Milpitas, CA (US)
Filed on May 23, 2022, as Appl. No. 17/750,864.
Prior Publication US 2023/0377972 A1, Nov. 23, 2023
Int. Cl. H01L 21/68 (2006.01); H01L 21/687 (2006.01); H01L 21/78 (2006.01); H10D 89/00 (2025.01)
CPC H01L 21/7806 (2013.01) [H01L 21/68721 (2013.01); H10D 89/013 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A die separation ring, comprising:
an annular body extending about a central axis, the annular body having a top and a bottom, the top comprising:
a first planar surface having a first elevation with respect to the bottom of the annular body;
a second planar surface having a second elevation with respect to the bottom of the annular body, the second elevation being lower than the first elevation; and
a transition surface extending between the first planar surface and the second planar surface, wherein:
the first planar surface is arranged to contact expansion material associated with a semiconductor wafer to cause the expansion material to expand in a first direction when the die separation ring moves in a direction parallel to the central axis from a first position to a second position; and
the second planar surface is arranged to contact the expansion material associated with the semiconductor wafer to cause the expansion material to expand in a second direction when the die separation ring moves from the first position to the second position, the expansion in the second direction being less than the expansion in the first direction.