US 12,347,720 B2
Apparatus for treating substrate
Jin Woo Jung, Cheonan-si (KR); Jin Mo Jae, Cheonan-si (KR); Sang Min Lee, Seoul (KR); Young Hun Lee, Cheonan-si (KR); Yong Hyun Choi, Cheonan-si (KR); Yong Joon Im, Yongin-si (KR); and Seung Hoon Oh, Cheonan-si (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Oct. 24, 2022, as Appl. No. 17/971,734.
Claims priority of application No. 10-2021-0142881 (KR), filed on Oct. 25, 2021.
Prior Publication US 2023/0129923 A1, Apr. 27, 2023
Int. Cl. H01L 21/687 (2006.01); B08B 3/04 (2006.01); B08B 13/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6875 (2013.01) [B08B 3/04 (2013.01); B08B 13/00 (2013.01); H01L 21/6708 (2013.01); H01L 21/68714 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a housing for providing a treating space for treating a substrate within;
a support unit for supporting the substrate in the treating space;
a bottom supply port for supplying a process fluid to the treating space; and
a filler member positioned below the substrate supported on the support unit in the treating space, and
wherein the filler member forms a buffer space facing the bottom supply port,
wherein a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate,
wherein the filler member comprises:
a base portion; and
a protrusion portion extending from a bottom surface of the base portion in a downward direction, and
wherein a slit in a spiral shape is formed along an inner surface along the inner surface of the protrusion portion which defines the buffer space.