US 12,347,716 B2
Method for cleaning electrostatic chuck
Yueh-Lin Yang, Tainan (TW); and Chi-Hung Liao, New Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Jun. 27, 2023, as Appl. No. 18/342,251.
Application 17/365,878 is a division of application No. 16/358,561, filed on Mar. 19, 2019, granted, now 11,056,371, issued on Jul. 6, 2021.
Application 18/342,251 is a continuation of application No. 17/991,724, filed on Nov. 21, 2022.
Application 17/991,724 is a continuation of application No. 17/365,878, filed on Jul. 1, 2021, granted, now 11,508,602, issued on Nov. 22, 2022.
Claims priority of provisional application 62/718,947, filed on Aug. 14, 2018.
Prior Publication US 2023/0343628 A1, Oct. 26, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B08B 5/04 (2006.01); B08B 3/04 (2006.01); B08B 7/00 (2006.01); C23C 14/50 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) [B08B 3/04 (2013.01); B08B 5/04 (2013.01); B08B 7/00 (2013.01); C23C 14/505 (2013.01); H01L 21/67011 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
moving an optical inspection instrument under a bottom surface of a chuck;
emitting, by a first portion of the optical inspection instrument, a radiation toward a bottom surface of the chuck, wherein the chuck is configured for fixing a semiconductor workpiece on the bottom surface, and the optical inspection instrument faces the bottom surface;
receiving, by a second portion of the optical inspection instrument, a reflection of the radiation reflected from the chuck to obtain a continuous line of intensities corresponding to locations on the chuck;
analyzing the reflection of the radiation based on the continuous line of the intensities corresponding to the locations on the chuck;
in response to that the continuous line of the intensities corresponding to the locations on the chuck has a valley, determining a particle is present on the bottom surface of the chuck;
after determining the particle is presented, moving the optical inspection instrument away from the bottom surface of the chuck;
after moving the optical inspection instrument away from the bottom surface of the chuck, moving a cleaning tool to a position under the bottom surface of the chuck; and
removing the particle by using the cleaning tool comprising an exhaust duct.