US 12,347,713 B2
Semiconductor apparatus with an alignment moat
Andrew D. Carswell, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on May 18, 2022, as Appl. No. 17/747,446.
Prior Publication US 2023/0377928 A1, Nov. 23, 2023
Int. Cl. H01L 21/68 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H01L 23/498 (2006.01)
CPC H01L 21/68 (2013.01) [H01L 21/486 (2013.01); H01L 24/04 (2013.01); H01L 24/65 (2013.01); H10D 84/0147 (2025.01); H10D 84/038 (2025.01); H01L 23/49827 (2013.01); H01L 2224/83894 (2013.01); H01L 2225/06562 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a conductive material divided into first and second portions which include top surfaces connected to each other, respectively;
a first spacer surrounding the first portion of the conductive material; and
a second spacer surrounding the second portion of the conductive material;
wherein a top surface of the first spacer and a top surface of the second spacer are indented from a top surface of the first portion and a top surface of the second portion, respectively, to define an alignment moat, where the alignment moat is fluid filled.