US 12,347,702 B2
Wet processing system and system and method for manufacturing semiconductor structure
Ying-Chieh Meng, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on May 26, 2022, as Appl. No. 17/824,926.
Prior Publication US 2023/0386870 A1, Nov. 30, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67201 (2013.01) [H01L 21/67742 (2013.01); H01L 21/67778 (2013.01); H01L 21/68714 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for wet processing, comprising:
a load lock chamber, configured to store a plurality of wafers that are to be processed;
a plurality of first chambers, configured to perform a first wet etching or a first wet cleaning on the plurality of wafers, wherein each of the plurality of first chambers has a plurality of first stage plates for supporting the plurality of wafers;
a plurality of second chambers, configured to perform a second wet etching or a second wet cleaning on a single wafer of the plurality of wafers, wherein each of the plurality of second chambers has a second stage plate for supporting a wafer of the plurality of wafers; and
a first robot, configured to transport the plurality of wafers from the load lock chamber to the plurality of first chambers,
wherein the first robot is arranged between the plurality of first chambers, the plurality of second chambers and the load lock chamber,
wherein one of the second chambers is disposed between two of the first chambers.