US 12,347,677 B2
Enhanced ignition in inductively coupled plasmas for workpiece processing
Stephen E. Savas, Pleasanton, CA (US); and Shawming Ma, Sunnyvale, CA (US)
Assigned to Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed by Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed on Nov. 7, 2023, as Appl. No. 18/503,681.
Application 17/827,198 is a division of application No. 16/547,724, filed on Aug. 22, 2019, granted, now 11,348,784, issued on May 31, 2022.
Application 18/503,681 is a continuation of application No. 17/827,198, filed on May 27, 2022, granted, now 11,848,204.
Application 16/547,724 is a continuation in part of application No. 16/537,748, filed on Aug. 12, 2019, abandoned.
Prior Publication US 2024/0071754 A1, Feb. 29, 2024
Int. Cl. H01L 21/02 (2006.01); H01J 37/32 (2006.01); H01L 21/263 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01)
CPC H01L 21/02315 (2013.01) [H01J 37/32119 (2013.01); H01J 37/32651 (2013.01); H01L 21/02348 (2013.01); H01L 21/67207 (2013.01); H01J 37/32449 (2013.01); H01L 21/263 (2013.01); H01L 21/762 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A plasma processing apparatus, comprising:
a plasma chamber comprises a plasma region;
a dielectric wall forming at least a portion of the plasma chamber;
an inductive coupling element located proximate the dielectric wall; and
an ultraviolet light source configured to emit an ultraviolet light beam through an ultraviolet emission assembly, the ultraviolet emission assembly comprises:
one or more metal surfaces facing an interior volume of the plasma chamber, the one or more metal surfaces arranged to emit one or more electrons into the plasma region; and
one or more reflective elements configured to reflect the ultraviolet light beam onto the one or more metal surfaces.