US 12,347,660 B2
Substrate processing apparatus, substrate processing system, and maintenance method
Atsushi Sawachi, Miyagi (JP); Jun Hirose, Miyagi (JP); Takuya Nishijima, Miyagi (JP); Ichiro Sone, Miyagi (JP); and Suguru Sato, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 18, 2024, as Appl. No. 18/746,251.
Application 18/746,251 is a continuation of application No. 17/504,578, filed on Oct. 19, 2021, granted, now 12,040,166.
Claims priority of application No. 2020-175383 (JP), filed on Oct. 19, 2020.
Prior Publication US 2024/0339306 A1, Oct. 10, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32733 (2013.01) [H01J 37/3244 (2013.01); H01J 37/32899 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber;
a substrate support disposed within the first chamber;
a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening;
a clamp that releasably fixes the second chamber to the movable part extending above the second chamber; and
a lift mechanism that includes a driver and a shaft configured to move the movable part upward and downward.