US 12,347,659 B2
Electrostatic chuck assembly for cryogenic applications
Vijay D. Parkhe, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 6, 2024, as Appl. No. 18/735,379.
Application 18/735,379 is a continuation of application No. 18/237,673, filed on Aug. 24, 2023, granted, now 12,033,837.
Application 18/237,673 is a continuation of application No. 17/317,816, filed on May 11, 2021, granted, now 11,776,794, issued on Oct. 3, 2023.
Claims priority of provisional application 63/151,294, filed on Feb. 19, 2021.
Prior Publication US 2024/0331987 A1, Oct. 3, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32724 (2013.01) [H01L 21/6833 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01); H01L 21/67069 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An electrostatic chuck assembly, comprising:
an electrostatic chuck having a workpiece supporting surface opposite a bottom surface;
a cooling plate having a top surface, the cooling plate further comprising:
a stack of alternating layers comprising a first layer and a second layer, wherein the first layer comprises an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 parts per million/° C. (ppm/° C.) and wherein the second layer comprises one or more metals selected from the group consisting of molybdenum, tungsten, chromium, iron, nickel, zirconium, iron-nickel-cobalt alloys, alloys thereof, and any combination thereof; and
a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate.