US 12,347,652 B2
Method for forming plasma coating
Lance A. Scudder, Sunnyvale, CA (US); Sukti Chatterjee, San Jose, CA (US); David Masayuki Ishikawa, Mountain View, CA (US); Yuriy V. Melnik, San Jose, CA (US); and Vibhas Singh, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 10, 2022, as Appl. No. 17/741,228.
Claims priority of provisional application 63/192,471, filed on May 24, 2021.
Prior Publication US 2022/0375723 A1, Nov. 24, 2022
Int. Cl. H01J 37/32 (2006.01); C23C 16/02 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/54 (2006.01)
CPC H01J 37/32449 (2013.01) [C23C 16/0272 (2013.01); C23C 16/345 (2013.01); C23C 16/40 (2013.01); C23C 16/403 (2013.01); C23C 16/4408 (2013.01); C23C 16/45536 (2013.01); C23C 16/4554 (2013.01); C23C 16/45553 (2013.01); C23C 16/45555 (2013.01); C23C 16/50 (2013.01); C23C 16/54 (2013.01); H01J 37/32743 (2013.01); H01J 37/32752 (2013.01); H01J 2237/20278 (2013.01); H01J 2237/332 (2013.01); H01J 2237/3321 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method of forming a coating of material on a substrate, the method comprising:
forming a plasma of a first precursor and an oxygen-containing precursor, wherein the first precursor and the oxygen-containing precursor are provided in a first flow rate ratio;
depositing a first layer of material on the substrate, wherein the first layer of material is characterized by a first concentration of hydrogen;
while maintaining the plasma, adjusting the first flow rate ratio to a second flow rate ratio; and
depositing a second layer of material on the first layer of material, wherein the second layer of material is characterized by a second concentration of hydrogen less than the first concentration of hydrogen, and wherein a flow-rate ratio of the oxygen-containing precursor to the first precursor is maintained at greater than or about 2.0:1 while depositing the first layer of material on the substrate, depositing the second layer of material on the first layer of material, or both.