US 12,347,626 B2
Ceramic electronic component and method of manufacturing the same
Sung Hyung Kang, Suwon-si (KR); Jong Hyun Cho, Suwon-si (KR); Ji Hong Jo, Suwon-si (KR); Hang Kyu Cho, Suwon-si (KR); Jae Shik Shim, Suwon-si (KR); Yong In Kim, Suwon-si (KR); and Sang Roc Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 26, 2024, as Appl. No. 18/423,740.
Application 18/423,740 is a continuation of application No. 18/085,840, filed on Dec. 21, 2022, granted, now 11,948,752.
Application 18/085,840 is a continuation of application No. 16/857,280, filed on Apr. 24, 2020, granted, now 11,569,037, issued on Jan. 31, 2023.
Claims priority of application No. 10-2020-0001979 (KR), filed on Jan. 7, 2020.
Prior Publication US 2024/0203663 A1, Jun. 20, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/4682 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); C04B 2235/652 (2013.01); C04B 2235/783 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the dielectric layer comprises a plurality of dielectric grains,
wherein at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell,
wherein the dual shell comprises a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and
the first shell in the core-dual shell structure is disposed to cover at least 90 area % of a surface of the core.