US 12,347,622 B2
Multilayer electronic component with a copper-containing external electrode
Young Ah Song, Suwon-si (KR); Bong Gyu Choi, Suwon-si (KR); Kwang Dong Seong, Suwon-si (KR); Jae Hoon Bang, Suwon-si (KR); Do Kyeong Lee, Suwon-si (KR); and Wan Sik Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 21, 2023, as Appl. No. 18/224,669.
Claims priority of application No. 10-2023-0022772 (KR), filed on Feb. 21, 2023.
Prior Publication US 2024/0282529 A1, Aug. 22, 2024
Int. Cl. H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01); H01G 4/12 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer;
an external electrode disposed on the body and connected to at least one of the internal electrodes,
wherein the external electrode includes a metal including Cu and Si,
wherein the metal included in the external electrode has crystallites having a size of 70 nm or more and 100 nm or less, measured from a peak of a plane obtained from an X-ray diffraction pattern.