US 12,347,481 B2
Universal memory for in-memory computing and operation method thereof
Feng-Min Lee, Hsinchu (TW); Po-Hao Tseng, Taichung (TW); Yu-Yu Lin, New Taipei (TW); and Ming-Hsiu Lee, Hsinchu (TW)
Assigned to MACRONIX INTERNATIONAL CO., LTD., Hsinchu (TW)
Filed by MACRONIX INTERNATIONAL CO., LTD., Hsinchu (TW)
Filed on Apr. 7, 2023, as Appl. No. 18/297,055.
Claims priority of provisional application 63/439,157, filed on Jan. 16, 2023.
Prior Publication US 2024/0242757 A1, Jul. 18, 2024
Int. Cl. G11C 11/405 (2006.01); G11C 11/4096 (2006.01); G11C 11/54 (2006.01); G11C 16/26 (2006.01)
CPC G11C 11/4096 (2013.01) [G11C 11/405 (2013.01); G11C 11/54 (2013.01); G11C 16/26 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A universal memory for In-Memory Computing (IMC), comprising:
at least one write word line;
at least one unit cell, including:
a write transistor, wherein a gate of the write transistor is connected to the write word line, and the write transistor is a transistor with adjustable threshold voltage; and
a read transistor, wherein a gate of the read transistor is connected to a drain or a source of the write transistor; and
at least one read word line, connected to a drain or a source of the read transistor;
wherein in a training mode, a storage potential of a storage node between the write transistor and the read transistor represents a weight of the unit cell;
in an inference mode, a threshold voltage of the write transistor represents the weight of the unit cell;
wherein a material of a channel layer of the write transistor is indium gallium zinc oxide (IGZO), indium oxide (In2O3), silicon (Si), germanium (Ge), or trivalent group-pentavalent group material.