US 12,347,075 B2
Infrared image processing device and infrared image processing method
Toshiki Fujino, Tokyo (JP); Kohei Kurihara, Tokyo (JP); Koichi Yamashita, Tokyo (JP); and Daisuke Suzuki, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 17/925,829
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Jun. 25, 2020, PCT No. PCT/JP2020/024953
§ 371(c)(1), (2) Date Nov. 17, 2022,
PCT Pub. No. WO2021/260871, PCT Pub. Date Dec. 30, 2021.
Prior Publication US 2023/0177653 A1, Jun. 8, 2023
Int. Cl. G06T 5/00 (2024.01); G06T 5/50 (2006.01); G06T 5/70 (2024.01); H04N 23/23 (2023.01)
CPC G06T 5/70 (2024.01) [G06T 5/50 (2013.01); H04N 23/23 (2023.01); G06T 2207/10048 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An infrared image processing device comprising:
a thermal image sensor to receive infrared rays and to output a signal corresponding to the infrared rays:
a processor to execute a program; and
a memory to store the program which, when executed by the processor, performs processes of,
generating a plurality of thermal images based on the signal;
performing a smoothing process on each pixel of each of the plurality of thermal images by using a pixel value of a vicinal pixel, thereby calculating a plurality of smoothed images and calculating smoothed pixel values, the smoothed pixel values being each image's pixel values after undergoing the smoothing:
calculating a correction coefficient set from the thermal images and the smoothed images, the correction coefficient set including a first correction coefficient and a second correction coefficient; and
correcting the thermal images by using the correction coefficient set.