US 12,346,024 B2
Method of manufacturing a master for a replication process
Ji Wang, Singapore (SG); Kam Wah Leong, Singapore (SG); QiChuan Yu, Singapore (SG); and Sundar Raman Gnana Sambandam, Singapore (SG)
Assigned to ams-OSRAM Asia Pacific Pte. Ltd., Singapore (SG)
Appl. No. 17/607,089
Filed by ams-OSRAM Asia Pacific Pte. Ltd., Singapore (SG)
PCT Filed May 28, 2020, PCT No. PCT/SG2020/050312
§ 371(c)(1), (2) Date Oct. 28, 2021,
PCT Pub. No. WO2020/242385, PCT Pub. Date Dec. 3, 2020.
Claims priority of provisional application 62/855,206, filed on May 31, 2019.
Prior Publication US 2022/0229362 A1, Jul. 21, 2022
Int. Cl. G03F 7/00 (2006.01); G03F 7/16 (2006.01)
CPC G03F 7/0005 (2013.01) [G03F 7/162 (2013.01); G03F 7/168 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method of manufacturing a master for use in a wafer-scale replication process, the method comprising:
(a) at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer; and
(b) a step of developing the at least one patterned layer to provide one or more structures defining the master;
wherein step (b) comprises spraying and/or spin coating the at least one patterned layer with a developer,
wherein a/the process of dry film lamination is used to form one or more layers having a thickness of 5 to 10 micrometers and/or a/the process of spaying/spin-coating a liquid photoresist is used to form one or more layers having a thickness of 5 to 10 micrometers.